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Shenzhen ECER Network Technology Co., Ltd.
Shenzhen ECER Network Technology Co., Ltd.
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TE Connectivity 5520257-2

Shenzhen ECER Network Technology Co., Ltd.
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TE Connectivity 5520257-2

Packaging Details : Through Hole

Shielding : Unshielded

Brand Name : 5520257-2

Stock : 58

Delivery Time : 1 working day

Number of Ports : 1

Model Number : 5520257-2

Description : Unshielded 1 -40℃~+85℃ Through Hole Modular/Ethernet Connector Jacks RoHS

MOQ : 1

Operating Temperature : -40℃~+85℃

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Product Overview

This product is a circular board (CIRCL 1 20ARD) designed for use with AR TILCPHINE HARDWARE. It conforms to RE& Bulletin 45-812b-16 and WOCJ regulations. The board features a minimum thickness of 1.27mm (0.050 inches) with nickel underplating and a minimum thickness of 0.07mm (0.003 inches) for hard gold localized plating.

BrandPANF
CertificationsCAATY CONFORNS TO RE& BULLETIN 45-812b-16, WOCJ_AR TILCPHINE HARDWARE
Package TypeSACKAGED IN TRAY
Part NumberThickness (mm)Plating (Nickel)Plating (Gold)Dimensions (mm)
31R0.361.27 0.05 (0.050 in)0.07 0.002 (0.003 in)0.07 0.002 (0.003 in)22.05 0.07 (0.868 0.003 in)
RO.E41.27 0.05 (0.050 in)0.07 0.002 (0.003 in)0.07 0.002 (0.003 in)2.178 0.003 (0.086 0.000 in)

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