| Product Model | TYC-302-08 |
| Customer Part NO. | TYC-302-08 |
| Version | B |
| Date Established | 20160620 |
| Scope | General |
| 2. Requirements |
| Voltage Rating | 30V AC |
| Current Rating | 3A |
| Operation Temperature Range | -30 to +80 |
| 3. Test Condition |
| Temperature Range | -15 to +35 |
| Humidity Range | 25% to 85% |
| 4. Test Methods and Requirements |
| 4.1 Examination of Product () | Visual: No peeling off of plating, deformation of the base, or damage. |
| 4.2 Electrical Performance | |
| Contact Resistance | 40m MAX (Mate applicable USB 3.1 TYPE-C, measure by dry circuit, 20mv MAX, 100mA) |
| Dielectric Withstanding Voltage | 100V AC (RMS.) for 1 minute between adjacent terminals of ground. No Breakdown or flashover. Leakage current: 0.5mA Max. |
| Insulation Resistance | 100M min (unmated) (Apply 500V DC for 1 minute between adjacent terminals of ground) |
| 4.3 Mechanical Performance | |
| Insertion/Withdrawal Force | Insertion: 0.50kgf/MIN, 2.0kgf/MAX; Withdrawal: 0.80kgf/MIN, 2.0kgf/MAX (Insertion and withdrawal speed: 25mm/minute) |
| Durability | 10000 cycles (Insert and extract applicable USB 3.1 TYPE-C at the speed rate of 12.5 mm/minute) |
| Vibration | Amplitude: 1.52mm P-P or 147m/s {15G}; Sweep time: 50-2000-50Hz in 20 minutes; Duration: 12 times in each (total of 36 times) X, Y, Z, axes. Appearance: No damage. Contact Resistance: Change from initial Value: 30m Max. (Electrical load DC 100mA current shall be flowed during the test.) |
| Physical Shock | Pulse width: 11msec; Waveform: Half-sine 490m/s50G3 strokes in each X, Y, Z axes. Appearance: No damage. Contact Resistance: Change from initial Value 40m Max. Discontinuity: 1 sec Max. |
| 4.4 Environmental Performance | |
| Thermal Shock Test | 10 cycles of: a) -553 for 30 minutes; b) +853 for 30 minutes. Appearance: No Damage. Contact Resistance: Change from initial Value 40m Max. |
| Solder Ability | To be dipped in the solder bath 2605 for 101 seconds. Inspected area of each lead must have 95% solder coverage. |
| Humidity (Mated Connectors) | Temperature: +25 to +85; Relative Humidity: 90% to 95%; Duration: 4 cycles (96 hours). Appearance: No Damage. Contact Resistance: Change from initial Value 30m Max. |
| Humidity (Unmated Connectors) | Temperature: +25 to +85; Relative Humidity: 90% to 95%; Duration: 4 cycles (96 hours). Appearance: No Damage. Conform to dielectric withstanding Voltage and Insulation Resistance requirements. |
| Salt Spray | Temperature: 352; Concentration for salt: 50%. Duration: 24H (Contact plated gold more than 15u, and shell material copper alloy or stainless). Duration: 12H (Contact plated gold less than 15u, and/or shell material steel). No detrimental corrosion (Terminal solder tail unrequested). |
| Cold Resistance (Unmated) | Expose to -253 for 168 hours. Appearance: No Damage. Contact Resistance: Change from initial Value 30m Max. Shell Part: Change from initial Value 50m Max. |
| Heat Resistance (Unmated) | Expose to 852 for 168 hours. Appearance: No Damage. Contact Resistance: Change from initial Value 30m Max. Shell Part: Change from initial Value 50m Max. |
| Thermal Aging (Unmated) | Expose to +852 for 250 hours. Appearance: No Damage. Contact Resistance: Change from initial Value 40m Max. |
| IR-reflow | Solder Temp: 2605, 101sec. No physical damage shall occur. |
