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Samtec EBTM-6-12-2.0-S-VT-1

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Samtec EBTM-6-12-2.0-S-VT-1

Model Number : EBTM-6-12-2.0-S-VT-1

Brand Name : Samtec

Packaging Details : -

Stock : 104

Description : Specialized Connectors RoHS

MOQ : 1

Delivery Time : 10-15 working days

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ExaMAX High-Speed Backplane System

The ExaMAX High-Speed Backplane System is designed for high-speed applications, meeting and exceeding industry specifications such as OIF CEI-28G-LR. It offers high performance with a staggered differential pair design, two reliable points of contact with a 2.4 mm wipe, and shielded wafer design to reduce crosstalk. Available in 24-72 pair designs with modular flexibility, it supports PCIe 6.0/CXL 3.1 and reduces costs through lower layer counts. The system is available in vertical and right-angle headers and uses press-fit tails for reliable electrical connections.

Product Attributes

Brand: Samtec
Certifications: PCI-SIG, PCI Express
Trademark: ExaMAX
Origin: Designed and built according to Samtec's specifications

Technical Specifications

Series	Insulator Material	Contact Material	Plating	Operating Temp Range	Current Rating	Voltage Rating	Lead-Free Solderable	Pitch	No. of Pairs per Column	Columns	Orientation	Guidance	Keying
EBTM/EBTF/EBDM	Liquid Crystal Polymer	Copper Alloy	Sn or Au over 50 " (1.27 m) Ni	-55 C to +105 C	4 A per pin	150 VAC	Yes	(2.00 mm) .0787"	-4, -6	-06, -08, -10, -12	VT (Vertical), RA (Right-Angle)	L (Left), R (Right)	A thru H
EPTT/EPTS	High Temperature Thermoplastic	Copper Alloy	Sn or Au over 50 " (1.27 m) Ni	-55 C to +105 C	14.1 A per pin	150 VAC	Yes	(2.00 mm) .0787"	-4, -6	-06, -08, -10, -12	VT (Vertical), RA (Right-Angle)	L (Left), R (Right)	A thru H
EBCM/EBCF	Liquid Crystal Polymer	Copper Alloy	Au over 50 " (1.27 m) Ni	-40 C to +105 C	3.6 A per pin	125 VAC	N/A	(2.00 mm) .0787"	-4, -6	-06, -08, -10, -12	VT (Vertical), RA (Right-Angle)	L (Left), R (Right)	A thru H

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